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帶錫膏測(cè)厚功能的自動(dòng)加錫裝置，系深圳市三捷機(jī)械設(shè)備有限公司自主研發(fā)，具備自主知識(shí)產(chǎn)權(quán)的一種新型自動(dòng)化設(shè)備。該裝置繼承了三捷機(jī)械自動(dòng)加錫各項(xiàng)優(yōu)點(diǎn)，如：兼容各類主流廠商的瓶裝錫膏，無(wú)需客戶更改特殊包裝；采用倒立式出錫，無(wú)需在錫膏瓶的底部鉆孔；程序控制移動(dòng)式加錫等。在此基礎(chǔ)上，新增了錫膏高度實(shí)時(shí)偵測(cè)功能。該功能有如下突出的特點(diǎn)：
激光測(cè)厚。該裝置采用激光反射傳感器，實(shí)施監(jiān)測(cè)鋼網(wǎng)上焊錫膏的滾動(dòng)直徑（圖1所示），當(dāng)所測(cè)的錫膏高度低于設(shè)定值時(shí)，即觸發(fā)加錫。相比于傳統(tǒng)的按照PCB板計(jì)數(shù)的功能，該功能對(duì)自動(dòng)加錫裝置作閉環(huán)控制，實(shí)時(shí)監(jiān)測(cè)鋼網(wǎng)上的錫膏厚度，測(cè)量精度可達(dá)1mm, 避免用計(jì)數(shù)方式設(shè)定加錫頻率而帶來(lái)的錫膏添加量不足的問(wèn)題。
圖1. 激光反射傳感器實(shí)施監(jiān)測(cè)鋼網(wǎng)上焊錫膏的滾動(dòng)直徑
通過(guò)實(shí)時(shí)監(jiān)測(cè)焊錫膏的滾柱高度，對(duì)鋼網(wǎng)上的錫膏實(shí)現(xiàn)了閉環(huán)控制（圖2）?？梢允冀K保持鋼網(wǎng)上有定量的錫膏，最大程度上提升了保證品質(zhì)。
圖2. 實(shí)時(shí)監(jiān)測(cè)焊錫膏的滾柱高度，對(duì)鋼網(wǎng)上的錫膏實(shí)現(xiàn)了閉環(huán)控制
節(jié)省焊錫膏。擠壓倒立式出錫，可使空瓶的錫膏殘留量少于6克(圖3)。減少浪費(fèi)。
圖3. 空瓶的錫膏殘留量少于6克
提高印刷效率。系統(tǒng)通過(guò)傳感器感知刮刀的上下運(yùn)動(dòng)，硬件和軟件均獨(dú)立加裝于印刷機(jī)之外。加錫時(shí)序位于2次PCB板進(jìn)板中間的間隔，或者印刷機(jī)擦拭鋼網(wǎng)的時(shí)間片刻，無(wú)需額外占用印刷機(jī)的生產(chǎn)時(shí)間，從而提升效率。
安全環(huán)保。自動(dòng)加錫可以有效避免操作員工同錫膏直接接觸，最大程度上降低了焊錫膏里揮發(fā)性溶劑和重金屬物質(zhì)對(duì)人體的傷害，保證人員健康。
通過(guò)加裝三捷機(jī)械的自動(dòng)加錫系統(tǒng)，可以使客戶的錫膏添加不再依賴于人工，另外，對(duì)于錫膏品種如錫膏種類、成分特性、有效期等，以及加錫過(guò)程參數(shù)如鋼網(wǎng)上的實(shí)時(shí)錫膏量、加錫頻率、每次的添加量等指標(biāo)都可以做有效管控。在可預(yù)見(jiàn)的將來(lái)，三捷機(jī)械的自動(dòng)加錫系統(tǒng)會(huì)被推廣并廣泛應(yīng)用于我國(guó)的SMT各行各業(yè)，從而為我國(guó)的工業(yè)制造盡一份綿薄之力。
Dispensing Unit with Paste Roll Height Monitor
Abstract: By installing auto paste dispenser with Paste Roll Height (PRH) monitor, the solder paste dispensing can be controlled as a close-loop system. Once the paste roll height is below the setting value, it will trigger automatic dispense.
Author: ShenZhen Synergies Machinery Co., Ltd
Date: Mar-22-2018
The solder paste dispenser with Paste Roll Height (PRH) monitor is a close-loop dispensing system developed by Shen Zhen Synergies Machinery. Compared to conventional units, the system is highlighted by the following strengths:
Compatible with different kinds of solder paste jars. The solder paste is squeezed by a special designed piston and there’s no need to drill holes underneath of the jar.
Dispensing on the fly. The solder paste dispensing trajectory can be programmed so that the solder paste can be evenly dispensed onto the stencil, the paste rolls are fully mixed and thus ensures best printing quality.
Real-time paste roll monitor. By mounting one or several laser-beam sensors around the paste roll, the system can inspect the real-time paste roll height. Once the paste roll height is below the setting value, it will trigger automatic dispense. Manufacturing defects caused by insufficient solder paste which is mostly caused by incorrect dispensing frequency can be eliminated by this close-loop system.
By installing auto paste dispenser with PRH monitor, the SMT printing progress can be greatly improved by:
The printing quality will be improved as the solder paste on the stencil can be maintained by a certain amount through the PRH monitoring.
Less residue on the empty jar, less waste. The residue solder paste on the jar can be squeezed as less as 6g, which reduces possible waste effectively.
More ergonomic and environmental. Operator no longer needs to touch the solder paste as it is enclosed by a chamber. This eliminates the risk of exposing the volatile solvent as well as the toxic metallic substances inside of the solder paste to the operators’ skin or eye.
